INVENS ROYAL R2 FLASH FILE SPD7731 5.1 PAC FIRMWARE 100% TESTED BY CHINA GSM FIRMWARE

T13_BOPAI_64_4_t13_bopai_S013_invens_dibai_64_4_5.1_invens-Royal_R2_Android_5.1_V02_20161101_Royal_R2

Model Name  : t13_bopai_S013_invens_dibai_64_4_dt
Model Brand : invens
Model Device: t13_bopai_S013_invens_dibai_64_4
AndrVersion : 5.1
BaseBand CPU: T13_BOPAI_64_4
Project Ver : invens-Royal R2_Android_5.1_V02_20161101
Model Ext   : Royal R2

[Read Mode] : HSUSB : 0x3000

[FW_READER] : Reading Firmware Now ...

[Read Ok] : u-boot-spl-16k.bin
[Read Ok] : u-boot.bin
[Read Ok] : prodnv.img
[Read Ok] : sc7731C_CP0_modem.bin
[Read Ok] : DSP_DM_Gx.bin
[Read Ok] : nvitem_w.bin
[Read Ok] : sc8830g_modem_CP2_Trunk_W15.49.3_Release.bin
[Read Ok] : nvitem_wcn.bin
[Read Ok] : logo_480x854.bin
[Read Ok] : fblogo_480x854.bin
[Read Ok] : thirdlogo.bin
[Read Ok] : forthlogo.bin
[Read Ok] : fifthlogo.bin
[Read Ok] : boot.img
[Read Ok] : system.img
[Read Ok] : oem.img
[Build Ok] : cache.img
[Read Ok] : recovery.img
[Build Ok] : userdata.img

AndroidInfo created
Firmware Size : 2329 MiB
Saved to : C:\Users\Desktop\CM2\T13_BOPAI_64_4_t13_bopai_S013_invens_dibai_64_4_5.1_invens-Royal_R2_Android_5.1_V02_20161101_Royal_R2\
Done!